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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 2000.01.15 Revised Date : 2001.05.01 Page No. : 1/3
HSMA5817 thru HSMA5819
1.0 AMP. SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Features
* Low Forward Voltage Drop * High Current Capability * High Reliability * High Surge Current Capability
Mechanical Data
Cases: SMA Molded Plastic Epoxy: UL 94V-0 rate flame retardant Lead: Axial leads, solderable per MIL-STD-202, Method 208 guaranteed Polarity: Color band denotes cathode end High temperature soldering guaranteed: 250C/10 seconds/.375"(9.5mm) lead lengths at 5 lbs., (2.3kg) tension, Weight:0.33gram
Maximum Ratings and Electrical Characteristics
Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking voltage Maximum Average Forward Rectified Current See Fig.1 Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on Rated Load(JEDEC method) Maximum Instantaneous Forward Voltage @1.0A Maximum D.C. Reverse Current (Note 1) at Rated DC Blocking Voltage Typical Thermal Resistance (Note 2) RJA Operating Junction Temperature Range TJ Storage Temperature Range TSTG HSMA5817 HSMA5818 HSMA5819 Units 20 30 40 V 14 21 28 V 20 30 40 V 1.0 40 0.45 0.55 0.60 A A V mA mA C/W C C
0.5(@TA=25C) 10(@TA=100C) 5.0(@TA=100C) 88 -65 to +125 -65 to +150 -65 to +150
Notes: 1.Pulse Test with PW=300 usec, 1% Duty Cycle 2. Measured on P.C. Board with 0.2x0.2"(5.0x5.0mm) Copper Pad Areas.
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : Preliminary Data Issued Date : 2000.01.15 Revised Date : 2001.05.01 Page No. : 2/3
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SMA/DO-214AC Dimension
Spec. No. : Preliminary Data Issued Date : 2000.01.15 Revised Date : 2001.05.01 Page No. : 3/3
A
B
C
D
H E F G
*:Typical
DIM A B C D
Inches Min. Max. 0.5000 0.0642 0.0901 0.1150 0.1575 0.1811 0.0783 0.1028
Millimeters Min. Max. 1.27 1.63 2.29 2.92 4.00 4.60 1.99 2.61
DIM E F G H
Inches Min. Max. 0.0299 0.0598 0.0039 0.0079 0.1890 0.2201 0.0059 0.0122
Millimeters Min. Max. 0.76 1.52 0.10 0.20 4.80 5.59 0.15 0.31
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,2000.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification

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